Product Information
SyncSol ETCF 1567
Thermal Conductive Tapes Double Sided Polyester
Product description
SyncSol Electrical Tapes Cross Filament ETCF 1567 Cross Filament Tape has fibreglass reinforced backing which is very high in tensile strength and is coated with adhesive. The fibreglass reinforced backing provides excellent abrasion, moisture and scuff resistance. We have four variants – hotmelt, rubber, solvent-low tack and solvent-residue free.
Cross Filament Tape is used for bundling/heavy duty packing of heavy objects such as pipes, steel coils, tires due to high tensile strength. It is also used in mounting and holding components in white goods industry, cricket bat industry and jumbo bags industry.
Main applications
SyncSol Electrical Tapes Cross Filament ETCF 1567 is Cross Filament Tape is used for bundling/heavy duty packing of heavy objects such as pipes, steel coils, tires due to high tensile strength. It is also used in mounting and holding components in white goods industry, cricket bat industry and jumbo bags industry.
Properties | Value |
---|---|
Base Material | Polyester – 25 µm |
Backing | Reinforced Fibreglass 100 µm |
Adhesive | Solvent |
Total Thickness | 155 µm |
Roll Ball Tack | 8 cms |
Elongation (% at break) | 130 % |
Adhesion to Steel (gms/inch) | 700 gms |
Temperature Resistance (℃/hr.) | 130 ℃ |
Dielectric Breakdown (v) | 5,500 v |
Insulation Resistance (MΩ) | 3 x 103 |
Electrolytic Corrosion | 1 |
Available Colour | Cream |
Industry
Construction Industry
Cladding, Doors & Windows, Building Wrap and other markets
Metal Industry
Our advanced adhesive-tape solutions for the metal-manufacturing process in metal-manufacturing and metalworking industry – from core starting all the way to the finished product.
Electronics
Our adhesive tape solutions for smartphones, tablets, notebooks, TVs, OLED technologies, displays, wearables and other smart devices.
Printing
Paper or film splicing and flexo plate mounting tapes are a few examples from our comprehensive range for web material production and processing.